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  Pulsed Laser Patterning

R2R and S2S Laser Scribing, Patterning and Cutting

OET provides the process technology platform for the optimization of short pulsed laser processing in production of Organic & Printed Electronics with minimal loss in active area and high quality in device performance. Short pulsed Laser scribing is considered ideal for selective thin film material removal on rigid and flexible substrates due to low temperature removal mechanism (Cold Ablation) via Ultra-Short Pulsed Lasers.

Short Pulse Laser1

OET's in-line R2R short pulsed laser unique processes and tools are ideal for:

  • Complete removal of multiple layers
  • No-surface contamination from re-deposited debris
  • No loss in performance of functional layers
  • Optimization of OPV device manufacturing

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R2R In-line Short Pulse Laser Scribing (PET/ITO/ZnO) P1 Process

A wide variety of materials can be processed by short pulsed laser scribing:

  • Metals
  • Semiconductors
  • Ceramics
  • Polymers
  • Thin films
  • ITO films
  • Glass
  • Photoresist
  • Composite
  • Resins

OET achieves complete removal of multiple layers without any residue by optimizing the key parameters in R2R manufacturing of OPV devices. Also, OET manufactures the required layer and device structure with laser cut (P1, P2, P3) processes that involve multiple steps with different optimized parameters.

 

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Steps for manufacturing Organic Photovoltaics (OPVs). Selective material scribing and patterning (P1, P2 & P3 Processes in OPVs). Maximum utilization of the OPV printed area with P1, P2 & P3 processes leaving dead area of less than 160 μm.

 

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Microscope view: Selected removal of ITO layer on PET substrate by patterned laser scribing.

Relevant Publications:
“Laser Patterning of smart Nanomaterials for Reel-to- Reel production of Organic Photovoltaic (OPV) Devices”, JLMN-Journal of Laser Micro/Nanoengineering Vol. 10, No. 2, 2015, DOI: 10.1117/12.2077488

“The effect of laser pulse duration and beam shape on the selective removal of novel thin film layers for flexible electronic devices”, Proc SPIE 9657 · July 2015, DOI: 10.1117/12.2175501

For more details about scribing – patterning possibilities pricing, you can contact us.