OET @ Syskevasia 18

OET successfully participated Syskevasia 18. We would like to thank all visitors who stopped by our booth and had the opportunity to get informed on OET’s packaging activities and explore exciting new possibilities. We are looking forward to meeting you Read more…

Syskevasia 18

OET will be participating the Syskevasia 18 exhibition. Visit our booth at Hall 2, Stand E34, we will be pleased to see you to further inform you about our endeavors and discuss the possibilities of cooperation. Looking forward to meeting you! You can Read more…

OET @ ICFPE 2018

OET is participating the 9th International Conference on Flexible and Printed Electronics, Grand Metropark Universal Dinosaur Town Hotel in Changzhou, China, September 25-28, 2018. OET’s CEO Mr. V.Matskos will be holding the company’s presentation “Tailored Fully Printed OPVs and OLEDs Read more…

OET @ the 83rd TIF

OET successfully participated the 83rd Thessaloniki International Fair. We would like to thank all visitors who stopped by our booth and had the opportunity to get informed on OET’s activities and discuss future endeavors. Looking forward to meeting you again!

CORNET

Horizon 2020-NMBP-07-2017 Project ID: 760949 Funding scheme: Research and Innovation action (RIA) “Multiscale modelling and characterization to optimize the manufacturing processes of Organic Electronics materials and devices” Duration (months): 36 2018-2020 (Active project) Participation of OET Project Budget: 3.998.750 € Read more…